Teams at Boeing

Designs, develops, verifies, debugs, and tests printed circuit boards featuring processors, FPGAs, mixed-signal circuits, and power conversion. Responsibilities include stack-up definition, component selection, signal and power integrity analysis, design reviews, documentation, board bring-up, manufacturability, sustaining engineering, and cross-functional requirements and schedule coordination.

Develop and verify ASICs, FPGAs, and SoCs for aerospace and space electronics. Responsibilities include HDL design, physical realization, IP integration, timing and design checks, UVM-based testbench development, functional and code coverage, FPGA prototyping, and hardware integration testing. The role is fully onsite in Mountain View, supports first-shift work, requires a related bachelor’s degree, U.S. citizenship, and the ability to obtain a Secret clearance.

Leads microelectronic packaging project execution for ARM-based processor and 3D advanced packaging solutions. Coordinates multidisciplinary engineering teams and suppliers, manages statements of work, trade studies, source selection, risks, resources, schedules, costs, performance metrics, and technical reviews from concept through production. The role aligns technical and business objectives, ensures delivery against project baselines, and supports secure computing solutions within Boeing’s defense organization.